Liquid crystal display module and an assembly method therefor

ABSTRACT

A display module of an LCD device having a rear case shaped as a four-cornered container having sidewalls on each of its four edges; a backlight assembly formed by depositing and fixing a reflector plate, a light guide plate, and a series of sheets onto a mold frame where a lamp assembly receiving portion, a gate PCB receiving portion, and a source PCB receiving portion are integrally formed; an LCD panel module having an upper panel, a lower panel coupled to the upper panel with a liquid crystal inserted therebetween, a gate PCB electrically connected to an end portion of the lower panel, and a source PCB electrically connected to another end portion of the lower panel and has a conductive pattern for an electric signal to be applied to an inverter; a main chassis which defines an active screen area of the LCD panel module and couples the mold frame and the LCD panel module to the rear case; and a front case coupled to the main chassis and covering a whole surface of the LCD panel module excluding the active screen area.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a liquid crystal display (LCD)module, and more particularly, to a slimmer display module and a methodfor assembling the same.

[0003] 2. Description of the Related Art

[0004] Recently, notebook computers having LCDs as display devices aregaining in popularity. Such notebook computers are small in size andthus easy to carry. Notebook computers are operated by internalbatteries, and can be used for a certain period of time withoutadditional power.

[0005] Notebook computers are designed to have a peripheral equipment,for example, a CD-ROM, a modem, a speaker, and so on, like a commondesktop computer. The screen of the notebook computer becomes larger asLCD manufacturing techniques develop. Recently, an LCD panel of 13 inchdiagonal size is being used for a notebook computer.

[0006] As the screen size increases, an overall size of the notebookcomputer increases, too. Accordingly, notebook computers weigh more,hindering the carriability. A common notebook computer has a thicknessof 40 mm, and a weight of 2 to 3 Kg. The larger screen may increase theweight.

[0007] A display module with an LCD panel weighs from 500 g to 700 g,which is a significant portion for an overall weight.

[0008] According to the conventional method, a backlight assembly ismounted to a rear case, and an LCD panel, a source and a gate PCBs areattached to a front case via an epoxy or a double-sided tape and areassembled into the rear case.

[0009] Here, the source and gate PCBs are electrically connected using aconnector member like a flexible printed circuit (FPC) which is alsoused for applying an electric signal to an inverter.

[0010] Accordingly, an overall structure of the display module becomescomplicated, and the assembly process also becomes complicated due tovarious connecting members.

[0011] In addition, a reliability against a shock or a vibration for thefinished product is degraded.

SUMMARY OF THE INVENTION

[0012] It is therefore an object of the present invention to achieve aslimmed display module by simplifying the structure of the displaymodule.

[0013] It is another object of the present invention to assemble adisplay module more efficiently.

[0014] According to an aspect of the present invention, there isprovided a display module including a rear case shaped as afour-cornered container having sidewalls at each of four edges, abacklight assembly formed by depositing and fixing a reflector plate, alight guide plate, and a series of sheets onto a mold frame thatintegrally has a lamp assembly receiving portion, a gate PCB receivingportion, and a source PCB receiving portion, an LCD panel module havingan upper panel, a lower panel coupled to the upper panel with a liquidcrystal layer inserted therebetween, a gate PCB electrically connectedto an end portion of the lower panel, and a source PCB electricallyconnected to another end portion of the lower panel and having aconductive pattern for an electric signal to be applied to an inverter,a main chassis that defines an active screen area of the LCD panelmodule and couples the mold frame and the LCD panel module to the rearcase, and a front case coupled to the main chassis and covering thewhole surface of the LCD panel module except for the active screen area.

[0015] According to the present invention, the source and gate PCBs ofthe LCD panel module are directly and electrically connected by aboard-to-board method. A first connector that connects the gate PCB andthe source PCB is formed on the gate PCB, while a second connector thatconnects the gate PCB and the source PCB is formed on the source PCB.The first and second connectors are coupled in such a manner that thesecond connector is located under the first connector.

[0016] According to the present invention, the source PCB and theinverter are directly and electrically connected by a board-to-boardmethod. The inverter has at one of its end portion a first connectorthat connects the source PCB and the inverter, and the source PCB has atone of its end portion a second connector that connects the source PCBand the inverter. The first and second connectors are coupled in such amanner that the second connector is located under the first connector.

[0017] According to the present invention, the source PCB iselectrically connected to the lower panel through an FPC, which has adriving IC mounted onto its rear surface. The gate PCB is electricallyconnected to the lower panel through an FPC, which has a driving ICmounted on its front surface.

[0018] In addition, a coupling hole for grounding as well as fixing thesource PCB to the rear surface of the mold frame is formed on the sourcePCB.

[0019] According to another aspect of the present invention, there isprovided a display module including a rear case shaped as afour-cornered container having sidewalls on each of four edges, abacklight assembly formed by depositing and fixing a reflector plate, alight guide plate, and a series of sheets onto a mold frame thatintegrally has a lamp assembly receiving portion, an inverter supportingbar, a gate PCB receiving portion and a source PCB receiving portion atits right, left, upper and left edges, an LCD panel module having anupper panel, a lower panel coupled to the upper panel with a liquidcrystal layer inserted therebetween, a gate PCB electrically connectedto an end portion of the lower panel, and a source PCB electricallyconnected to another end portion of the lower panel which is adjacent tothe one end portion of the lower panel, a main chassis that defines anactive screen area of the LCD panel module and couples the mold frameand the LCD panel module to the rear case, and a front case coupled tothe main chassis and covering the whole surface of the LCD panel moduleexcept for the active screen area.

[0020] According to the present invention, a protrusion is formed on theupper surface of the inverter supporting bar, and an aperture for theinsertion of the protrusion is formed in the corresponding position ofthe inverter. Preferably, a guide groove is formed in widthwisedirection in the inverter corresponding to the inverter supporting bar.

[0021] According to the present invention, the inverter is supported bythe inverter supporting bar, so that components mounted to the invertercan face the rear case.

[0022] The gate PCB receiving portion of the mold frame has a pluralityof windows for accommodating components mounted to the gate PCB and aresurrounded by sidewalls and separated by separating walls.

[0023] In addition, the FPC that electrically connects the lower paneland the source PCB is bent by 180 degree so that the source PCB is fixedonto the rear surface of the mold frame. Preferably, a driving ICinsertion groove for accommodating the driving IC mounted to the FPC isformed on the lower edge of the rear surface of the mold frame.

[0024] In addition, the mold frame has a supporting plate, and theportion corresponding to the source PCB is removed from the supportingplate.

[0025] According to still another aspect of the present invention, thereis provided a display module including, a rear case shaped as afour-cornered container having sidewalls at each of four edges, abacklight assembly formed by depositing and fixing a reflector plate, alight guide plate, and a series of sheets onto a mold frame thatintegrally has a lamp assembly receiving portion, an inverter supportingbar, a gate PCB receiving portion and a source PCB receiving portion, anLCD panel module having an upper panel, a lower panel coupled to theupper panel using a liquid crystal layer inserted therebetween, a gatePCB electrically connected to an end portion of the lower panel, and asource PCB electrically connected to another end portion of the lowerpanel and having a conductive pattern for an electrical signal to beapplied to an inverter; a main chassis that defines an active screenarea of the LCD panel module and couples the mold frame and the LCDpanel module to the rear case; and a front case to be coupled to themain chassis and which covers the whole surface of the LCD panel moduleexcluding the active screen area.

[0026] Hinge receiving portions are formed in both end portions of thelower edge of the rear case, and an insulator is deposited onto thebottom surface of the rear case at the portions corresponding to thelamp assembly, the gate PCB, the source PCB and the inverter. Aninsulating tape, for example, can be used as an insulator.

[0027] Preferably, the rear case is made of a magnesium alloy.

[0028] A plurality of bosses for fixing the main chassis are formed ontothe bottom surface of the rear case.

[0029] Preferably, guide walls are formed spaced apart from each otherand toward the inner side from the upper and lower walls of the rearcase at irregular intervals. The size defined by such guide walls is thesame as that of the mold frame.

[0030] According to the present invention, an electrical signal istransmitted from a main body of a computer to the source PCB of the LCDpanel module via the FPC that connects the source PCB and the main bodyof the computer. The center of FPC in the lengthwise direction thatconnects the source PCB and main body of the computer is attached to anFPC holder one end of which is to be fixed to the hinge, and the bothend portions of the FPC are wound rotatably several times onto the FPCholder. In addition, one end portion of the FPC is inserted into aterminal block mounted to the source PCB, and another end portion of theFPC has a connector for a connection with the main body of the computer.

[0031] According to the present invention, the main chassis is shaped asa four-cornered container, four edges of which have respectivesidewalls, and has a plurality of coupling holes for coupling to thebosses that are formed integrally with the rear case.

[0032] The main chassis has at its center a window for an active screenarea. The main chassis is sized to leave a certain space betweensidewalls of the main chassis and the rear case, when the main chassisis fixed to the rear case.

[0033] At least one of the coupling holes formed at the main chassis isconnected to the boss of the rear case via a tab of the mold frame.Preferably, the main chassis is made of stainless steel.

[0034] According to the present invention, the front case are shaped asa four-cornered container of which four edges have walls respectively.The center of the front case has a window for an active screen area. Inaddition, the front case has at its rear surface protrusions to beinserted into the grooves formed on the walls of the main chassis, alongits edge.

[0035] In addition, a hinge cover portion is formed at the front casecorresponding to the hinge receiving portion of the rear case.

[0036] According to still another aspect of the present invention, thereis provided a method for assembling a display module of the presentinvention including the steps of mounting an LCD panel to a backlightassembly that is formed by depositing a reflector plate, a light guideplate, and a series of sheets onto a mold frame, and fixing a source PCBof the LCD panel to a rear surface of the mold frame by bending thesource PCB, mounting the backlight assembly to a rear case, mounting aninverter to an inverter supporting bar formed integrally with the moldframe, coupling a main chassis to the rear case so as to fix thebacklight assembly and define an active screen area, and coupling thefront case to the main chassis so as to cover a whole surface excludingthe active screen area of the LCD panel.

[0037] According to the present invention, when the source PCB of theLCD panel is fixed to the rear surface of the mold frame, the source andgate PCBs of the LCD panel are directly and electrically connected by aboard-to-board method.

[0038] In addition, the source PCB and the inverter are directly andelectrically connected by a board-to-board method after the inverter ismounted to the inverter supporting bar of the mold frame.

BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above object and other advantages of the present inventionwill become more apparent by describing in detail the preferredembodiments thereof with reference to the accompanying drawings, inwhich:

[0040]FIG. 1 is an exploded perspective view showing a display moduleaccording to the present invention;

[0041]FIG. 2 is a perspective view showing a rear case according to thepresent invention;

[0042]FIG. 3 is a perspective view showing a mold frame according to thepresent invention;

[0043]FIG. 3A is a perspective view showing a structure for fixing alamp wire according to the present invention;

[0044]FIG. 4A is a rear elevation showing one end portion of an upperedge of a rear surface of the mold frame according to the presentinvention;

[0045]FIG. 4B is a perspective view showing a driver IC insertion grooveof a lower edge of the rear surface of the mold frame according to thepresent invention;

[0046]FIG. 5 is a perspective view showing an inverter to be mounted toa mold frame;

[0047]FIG. 6 is a perspective view showing a front surface of an LCDpanel module according to the present invention;

[0048]FIG. 7 is a perspective view showing a rear surface of an LCDpanel module according to the present invention;

[0049]FIG. 8 is a perspective view showing a connector for connectingthe LCD panel module and a main body of a computer according to thepresent invention;

[0050]FIG. 8A is a perspective view showing a hinge according to thepresent invention;

[0051]FIG. 9 is a perspective view showing a main chassis according tothe present invention;

[0052]FIG. 10 is a perspective view showing a front case according tothe present invention;

[0053]FIG. 11 is an exploded perspective view showing a mold frame, areflector plate, a light guide plate, and a series of sheets to beassembled as a backlight assembly according to the present invention;

[0054]FIG. 12 is a rear elevation showing a source PCB mounted onto therear surface of the mold frame according to the present invention;

[0055]FIG. 13 is an exploded perspective view showing an LCD panelmodule and a rear case before they are assembled, and an inverter beforeit is mounted to the mold frame according to the present invention;

[0056]FIG. 14 is an exploded perspective view showing the main chassisfor which the assembly process with reference to FIG. 13 is completed;and

[0057]FIG. 15 is an exploded perspective view showing the front case forwhich the assembly process with reference to FIG. 14 is completed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0058] The present invention now will be described more fullyhereinafter with reference to the accompanying drawings, in whichpreferred embodiments of the invention are shown. This invention may,however, be embodied in many different forms and should not be construedas limited to the embodiments set forth herein.

[0059] First, terms as used throughout this specification are defined asfollows.

[0060] The term of a “rear case” can be also used as a “back bezel”which is referred to as a unit for covering the rear surface of thedisplay module.

[0061] The term of a “backlight assembly” is referred to as a unit wherea lamp assembly is mounted to a mold frame, and a reflector plate, alight guide plate, and a series of sheets are deposited and fixed to themold frame.

[0062] The term of an “LCD panel module” is referred to as a unitincluding an LCD panel, and a source and a gate PCBs which areelectrically connected to the LCD panel.

[0063] The term of an “LCD module” is referred to as a unit where theLCD panel module is mounted to the backlight assembly.

[0064] The term of a “front case” can be also used as a “front bezel”which is referred to as a unit for covering the whole surface of thedisplay module.

[0065] Now referring to FIG. 1, the display module of the presentinvention includes a rear case 100, a mold frame 200 directly fixedattachably/detachably onto/from the rear case 100, an LCD module 300 tobe accommodated into the mold frame 200, a main chassis 400 that definesan active screen area of the LCD module 300 and couples the mold frame200 and the LCD module 300 to the rear case 100, and a front case 500that covers the whole surface of the LCD module 300 excluding the activescreen area.

[0066] Referring to FIG. 2, the rear case 100 of the present inventionis shaped as a four-cornered container, and is composed of substanceshaving a strong endurance against a shock and an excellent exothermicfeature than a common resin, for example, a magnesium alloy. The rearcase 100 has various bosses integrally formed by die-casting.

[0067] Sidewalls 140 are formed by extending to a predetermined heightfrom the four edges of the rear case 100, and hinge receiving portions150 into which hinges that will be described later are to beaccommodated are formed at both ends of the lower wall 140. In addition,locking portions 160 for connecting a main body (not shown) of acomputer are disposed at both ends of the upper wall 140.

[0068] A plurality of guide walls 110 are formed at regular intervalsspaced apart from each other and toward the inside of the walls 140. Thesize defined by such guide walls 110 is the same as that of the moldframe 200, which will be discussed later. Therefore, the mold frame 200can be easily assembled into the rear case with the help of the guidewalls 110, and can be precisely fixed to the rear case 100.

[0069] A plurality of bosses 130, 132, 134, 135, 136, 138 are integrallyformed on the rear case 100 along the walls 140. The boss 130 is forfixing the main chassis 400, the boss 132 is for fixing the main chassis400 and the front case 500, the boss 134 is for fixing the mold frame200, the boss 135 is for fixing the mold frame 200 and the main chassis400 altogether, the boss 136 is for fixing an inverter, and the boss 138is for fixing a hinge cover (not shown) that prevents a possibledeviation of the hinge.

[0070] The rear case 100 is provided with an insulating tape 120 atportions corresponding to a lamp assembly, source/gate PCBs, and theinverter of the LCD module 300. Since the rear case 100 is composed of amagnesium alloy, which is conductive, the rear case 200 needs to beinsulated from the lamp assembly, source/gate PCBs, and the inverter forelectrostatic shielding. An insulating material may be applied insteadof the insulating tape 120.

[0071] Referring to FIG. 3, the mold frame 200 has a main receiving area280 into which a reflector plate, a light guide plate, and a series ofsheets are deposited and accommodated. The main receiving area 280 hasat its bottom an integrally formed supporting plate 270 to support thereflector plate and to ensure the space for accommodating the sourcePCB.

[0072] The main receiving area 280 has at its upper edge a lamp assemblyreceiving portion 210 formed integrally therewith and accommodating thelamp assembly.

[0073] Referring to FIG. 3A, the lamp assembly receiving portion 210 hasa reinforcement rib 214 for reinforcing the lamp assembly receivingportion, which is formed integrally where a lamp wire 211 a escapes fromthe interior of the lamp assembly receiving portion 210. Fixing ribs 213for fixing a lamp wire 211 b are formed at the other end portions of thelamp assembly receiving portion 210. The reinforcement rib 214 supportsthe lamp wire 211 a, and reinforces the fragile area of the lampassembly receiving portion 210 caused by forming an exit for the lampwire 211 a. In addition, fixing ribs 213 are formed alternately at theopposite edges of the end portion of the lamp assembly receiving portion210 so that the lamp wire 211 b can be fixed between the fixing ribs213.

[0074] Accordingly, lamp wires 211 a, 211 b come from the lamp assemblyreceiving portion 210 toward the inverter, which protects lamp wires 211a, 211 b from the possible damage by a screw in the later assemblyprocess. The fixing ribs 213 fix the lamp wire 211 b, and thuspreventing any force applied to the lamp wire 211 b, from beingtransmitted to an electrode of the lamp.

[0075] Referring to FIG. 4A, a lamp reflector plate 215 is exposed tothe outside of the mold frame 200 and fixed onto the rear surface of themold frame 200. In addition, wires 211 a, 211 b connected to bothelectrodes of the lamp are connected to a lamp power supply maleconnector 212 shown in FIG. 3 from the lamp assembly receiving portion210.

[0076] Referring back to FIG. 3, a gate PCB receiving portion 240 isformed at the left edge of the main receiving area 280. The gate PCBreceiving portion 240 is composed of a plurality of windows 242 whichare surrounded by sidewalls 241 and separated by separating walls 243. Awindow 242 has a predetermined height by heights of walls 241, 243 so asto contain elements mounted on the gate PCB connected to the LCD panel.Source and gate PCBs are directly and electrically connected via windows242, which will be described later.

[0077] The main receiving area 280 has a pair of inverter supportingbars 262, 264 at its right edge. In addition, inverter supporting bars262 have insertion protrusions 262 a, 264 a at their end portions.

[0078] Referring to FIG. 5, an inverter PCB 610 has at one end portionthereof a lamp power supply female connector 620 to be coupled to thelamp power supply male connector 212 shown in FIG. 3, and, at anotherend portion thereof a male connector 660 for directly connecting theinverter to the source PCB.

[0079] Insertion holes 640 for the protrusions 262 a, 264 a of theinverter supporting bars 262, 264 shown in FIG. 3 are formed at thecorresponding portions of an inverter 600. Preferably, guide grooves 645are formed at the portions corresponding to the inverter supporting bars262, 264 so that the inverter supporting bars 262, 264 can be morefirmly fixed. In addition, a coupling hole 650 is formed at the portioncorresponding to the boss 260 shown in FIG. 2, so as to be coupled tothe boss 260 by a screw.

[0080] Reference numeral 630 denotes elements mounted on the inverter600.

[0081] As shown in FIG. 3, tape carrier package (TCP) receiving portions220 for accommodating TCP of the source PCB that is bent and goes towardthe rear surface of the mold frame 200 are formed at the bottom edge ofthe main receiving area 280. That is, as shown in FIG. 4B, a pluralityof, say, three separating protrusions 221 are formed on the frontsurface of the mold frame 200, and a plurality of driver IC receivinggrooves 222 are formed between the separating protrusions 221 at therear surface of the mold frame 200.

[0082] The mold frame 200 has at its four corners tabs 234 to be coupledto bosses 130, 134, 135 of FIG. 2, and each tab 234 is provided with aground clip (not shown).

[0083] The main receiving area 280 has at its four corners protrusions252 for fixing the LCD panel when the LCD panel module is mounted to themold frame 200, and which are formed to the height corresponding to thethickness of the LCD panel.

[0084] Now referring to FIG. 6, the LCD panel module 300 includes anupper panel 310, a lower panel 320, a source PCB 340 connected to aconnector pad for the data line in the lower panel 320, and a gate PCB330 connected to a connector pad for the gate line in the lower panel320.

[0085] The source PCB 340 is electrically connected to the data line ofthe lower panel 320 via the TCP 342 for use of the source PCB 340 ontowhich a driver IC 344 as shown in FIG. 7 is mounted. As the pitchbetween the wirings of TCP is becoming more minute, a thermocompressionmethod is widely used. The driver IC 344 is mounted to the rear surfaceof the TCP 342, so that the driver IC 344 is accommodated onto the rearsurface of the mold frame 200 when the source PCB 340 rotates by 180degrees and is fixed onto the rear surface of the mold frame 200. Toallow the source PCB 340's 180 degree rotation, a sufficient spacebetween the lower panel 320 and the PCB 340 is necessary.

[0086] The gate PCB 330 is electrically connected to the gate line ofthe lower panel 320 via the TCP 332 for the gate PCB 330 onto which adriver IC 334 is mounted. As described above, the pitch between thewirings of TCP is becoming more minute, a thermocompression method iswidely used. The driver IC 334 is mounted to the front surface of theTCP 332. The gate PCB 330 needs to be tightened to the lower panel 320for secure bondage.

[0087] According to the present invention, the gate PCB 330 and thesource PCB 340 are directly and electrically connected via a connector,and the inverter 600 and the source PCB 340 are directly andelectrically connected via a connector. This will be explained in moredetail with reference to FIGS. 6 and 7.

[0088] Referring to FIG. 7, the gate PCB 330 has at the center of itsrear surface a male connector 336 for connecting the gate PCB 330 andthe source PCB 340. The source PCB 340 has at its rear surface a femaleconnector 346 for connecting the gate PCB 330 and the source PCB 340.Male and female connectors 336, 346 are coupled by rotating the sourcePCB 340. Here, male and female connectors 336, 346 are coupled via thewindow 242 shown in FIG. 3.

[0089] In addition, a female connector 360 for connecting the source PCBand the inverter is formed at the portion of the rear surface of thesource PCB 340 corresponding to the inverter 600. The female connector360 is exposed to the front surface of the LCD panel as the source PCB340 is rotated, and is coupled to the male connector 660 shown in FIG. 5when the inverter 600 is fixed to the inverter supporting bars 262, 264of the mold frame 200.

[0090] According to the present invention, the conductive pattern 350for providing the inverter 600 with an electric signal is formed at therear surface of the source PCB 340.

[0091] A coupling hole 355 electrically connected to the ground clipfixed to the tab 234 of the mold frame 200, which fixes the source PCB340 onto the rear surface of the mold frame 200, is formed at both endportions of the source PCB 340 in lengthwise direction. A coupling hole352 is formed in the vicinity of the female connector 346.

[0092] Referring to FIG. 8, an FPC 370 is rotatably wound around an FPCholder 374, and is shaped like a step when unwound, with one end to thesource PCB side and the other end to the main body of the computer. TheFPC 370 has one of its end portion be inserted into a terminal block 376of the source PCB 340 and the other end portion provided with aconnector 372 be connected to an interface of the main body of thecomputer, for example, a notebook computer.

[0093] The FPC holder 374 is fixed to a hinge when accommodated into thehinge receiving portion 150, which will be described later. That is, ahinge 151 includes a fixing portion 155 to be fixed to the rear case100, and an operation portion 157 coupled to the main body of thecomputer so as to rotate. The FPC holder 374 is screwed to the couplinggroove 156.

[0094] Reference numeral 158 denotes a through hole for fixing thefixing portion 155 of the hinge 151 to the rear case 100.

[0095] Referring to FIG. 9, the main chassis 400 has at its frontsurface a window 440, and is made of stainless steel. The window 440 hasa size corresponding to the active screen area of the LCD panel module300.

[0096] Sidewalls of the main chassis 400 is extended at all its fouredges to the same height as that from the bottom surface of the rearcase 100 up to the LCD panel module 300.

[0097] A gate PCB covering portion 410 and an inverter covering portion420 having a predetermined width are formed respectively in the regionbetween the left, right edges of the window 440 and the left, rightedges of the main chassis 400. When the main chassis 400 covers the LCDpanel module 300, which will be described later, the gate PCB coveringportion 410 and the inverter covering portion 420 respectively cover thegate PCB 330 and the inverter 600.

[0098] The main chassis 400 has coupling holes 430 at its upper andbottom edges corresponding to the boss 130 of the rear case 100, tothereby fix the main chassis 400 to the rear case 100. In addition, themain chassis 400 has coupling holes 432 at its bottom edge so that themain chassis 400 can be fixed to the rear case 100. The main chassis 400is coupled to the boss 135 of the rear case 100 together with the moldframe 200 via coupling holes 435.

[0099] However, the above-described coupling holes may have variousshapes.

[0100] In addition, coupling holes 450 for coupling with the front caseare formed on the sidewall of the main chassis 400.

[0101] Meanwhile, it is desirable that the main chassis 400 has a sizeto such an extent that a predetermined space is provided between thesidewalls of the main chassis 400 and the sidewalls of the rear case 100when the main chassis 400 is fixed to the rear case 100.

[0102]FIG. 10 illustrates the front case of the present invention.

[0103] Referring to FIG. 10, the front case 500 is made of a plastic,and has a size corresponding to the rear case 100. Like the main chassis400, the front case 500 has walls extended from its four edges.

[0104] In addition, the front case 500 has a window 540 of the same sizeas that of the window 440, and coupling holes 532 respectivelycorresponding to coupling holes 432 of the main chassis 400.

[0105] The front case 500 has hinge covering portions 550 respectivelyat the portions corresponding to the hinge receiving portion 150 of therear case 100, and is coupled to the hinge receiving portion 150 whenaccommodating the hinge 151 shown in FIG. 8A into the hinge receivingportion 150, which will be described later.

[0106] In addition, protrusions 535 are formed at the rear surface ofthe front case 500 along its edge, and are inserted into coupling holes450 to be fixed to the main chassis 400.

[0107] The front case 500 has openings 510 at both end portions of thewall thereof for the locking portions 160 shown in FIG. 2.

[0108] A method for assembling a display module of the present inventionwill be explained hereinafter.

[0109] First, an LCD panel module is assembled to a backlight assembly,which then is fixed to a rear case. Next, an inverter is mounted, and amain chassis completely fixes the modules to the rear case. Then, afront case is coupled thereto, thereby completing an assembly.

[0110] Here, the backlight assembly refers to a unit where a lampassembly, a reflector plate, a light guide plate, and a series of sheetsare mounted to a mold frame, and can be manufactured through a separateassembly process aside from the main assembly process. For example, thebacklight assembly can be prepared and delivered by a third partymanufacturer, and used in the main assembly process. This significantlyreduces the number of processes in the main assembly process.

[0111] Now, a method for assembling a backlight assembly will beexplained with reference to FIGS. 4A and 11.

[0112]FIG. 11 is an exploded perspective view showing a mold frame, areflector plate, a light guide plate, and a series of sheets to beassembled as a backlight assembly according to the present invention.

[0113] Referring to FIG. 4A and FIG. 11, a lamp reflector plate 215 isaccommodated into the lamp assembly receiving portion 210 formedintegrally with the upper edge of the main receiving area 280. Then, thelamp spaced apart from the lamp reflector plate 215 is accommodated andfixed by a lamp holder (not shown). The lamp reflector plate 215 isexposed toward the rear surface of the mold frame 200, and grounded tothe rear case 100. Wires 214 connected to both electrodes of the lampare extended from the lamp assembly receiving portion 210, and connectedto the lamp power supply male connector 212.

[0114] The reflector plate 10 is accommodated into the main receivingarea 280 and contacts the supporting plate 270. Subsequently, the lightguide plate 12, a diffusion sheet 14, and a pair of prism sheets 16 aresequentially deposited. Then, a cover sheet 18 is deposited thereon. Arubber pad 20 is used to seal the space between the cover sheet 18 andthe mold frame 200.

[0115] The rubber pad 20 seals the accommodated sheets into the mainreceiving area 280, shielding light leakage between sheets and the moldframe 200.

[0116] Then, the LCD panel module 300 is assembled to the backlightassembly.

[0117] Referring to FIGS. 3, 4B, 6, 7 and 12, the LCD panel module 300is mounted in such a manner that the lower panel 320 is accommodatedinto the region defined by protrusions 252 of the mold frame 200.Therefore, once installed within the region, the LCD panel module 300may not move because protrusions 252 secures it.

[0118] Then, the source PCB 340 is rotated by 180 degrees toward therear surface of the mold frame 200. At this time, TCPs 342 areaccommodated, for example, in pairs, into the TCP receiving portion 220formed at the lower edge of the mold frame 200. In addition, the driverIC 344 mounted to the rear surface of the TCP 342 is accommodated intothe driving IC receiving groove 222 formed at the rear surface of themold frame 200 when the TCP 342 is bent toward the rear surface of themold frame 200. In this manner, the source PCB 340 can be fixed to therear surface of the mold frame 200.

[0119] Some portions of the supporting plate 270 of the mold frame 200corresponding to the source PCB 340 are eliminated, so that the sourcePCB 340 can be put together evenly with the supporting plate 270 whenthe source PCB 340 is fixed to the rear surface of the mold frame 200.

[0120] The female connector 346 and the male connector 336 are directlycoupled by being pressed. Here, connectors 346, 336 are coupled by thewindow 242 of the gate PCB receiving portion 240.

[0121] Then, the source PCB 340 is fixed to the rear surface of the moldframe 200 via coupling holes 355, 352 formed at the source PCB 340. Asdescribed above, coupling holes 355 are electrically connected to theground clip fixed to the tab 234 of the mold frame 200, which allowscoupling holes 355 to ground the source PCB 340.

[0122] An end portion of the FPC 370 is inserted into the terminal block376 of the source PCB 340, and the insulator tape 122 is provided so asto cover the terminal block 376.

[0123]FIG. 13 is an exploded perspective view showing an LCD panelmodule and a rear case before they are assembled, and an inverter beforeit is mounted to the mold frame according to the present invention.

[0124] Referring to FIG. 13, the mold frame 200 can be easily fixed byguide walls 110 when the LCD module is positioned to the rear case 100.

[0125] When the mold frame 200 is fixed, the mold frame 200 and the rearcase 100 are aligned in such a manner that centers of tabs 234 andbosses 138 correspond. Thus, tabs 234 are fixed respectively to bosses138 using screws 238. At this time, the mold frame 200 and the rear case100 may not fully coupled by fixing tabs 234 to bosses 138. But this maysecure the mold frame 200 to the rear case 100 during the subsequentprocess.

[0126] The hinge 151 shown in FIG. 8A is mounted to the rear case 100.In more detail, the hinge 151 is fixed to the boss 138 of the rear case100 by fixing a screw into the through hole 158 formed at the fixingportion 155 of the hinge 151. In addition, an end portion of the FPCholder 374 that holds the FPC 370, is fixed via the coupling groove 156.

[0127] Then, the inverter 600 is fixed to the mold frame 200 and therear case 100. That is, the lamp power supply male connector 212 isinserted into the lamp power supply female connector 620, andprotrusions 262 a, 264 a of supporting bars 262, 264 are inserted intoinsertion holes 640. If the guide groove 645 having a predetermineddepth is formed at the corresponding position of supporting bars 262,264, the inverter 600 can be fixed more stably to supporting bars 262,264.

[0128] The male connector 660 formed at the inverter 600 is insertedinto the female connector 360 exposed toward the rear surface of themold frame 200. Then, the inverter 600 is fixed to the rear case 100 atthe boss 136 by fixing a screw 652 via the coupling hole 650.

[0129]FIG. 14 is an exploded perspective view showing the main chassis400 for which the assembly process with reference to FIG. 13 iscompleted.

[0130] Referring to FIG. 14, when the main chassis 400 is mounted to thefront surface of the assembly explained with reference to FIG. 13, wallsextended from the edges of the main chassis 400 reach the bottom surfaceof the rear case 100.

[0131] A plurality of screws 490 are directly fixed into bosses 130, 135of the rear case 100 via a plurality of coupling holes 430 formed at themain chassis 400. The screw 455 is fixed into the boss 135 via thecoupling hole 435 and the tab 235 of the mold frame 200.

[0132] As a final step, the front case 500 is coupled to the rear case200.

[0133] Referring to FIG. 15, when the front case 500 is mounted,protrusions 535 formed along the edge of the rear surface of the frontcase 500 as shown in FIG. 10 are inserted into the coupling holes 450formed on sidewalls of the main chassis 400 shown in FIG. 9. Then,screws 538 are fixed to bosses 132 of the rear case 100 via the couplinghole 532 formed at the lower edge of the front case 500 and couplingholes 432 of the main chassis 400. At this time, locking portions 160 ofthe rear case 100 are inserted into the grooves 510 formed at the upperwall of the front case 500.

[0134] The display module of an LCD of the present invention is thuscompleted.

[0135] The present invention has some advantages as follows.

[0136] A predetermined conductive pattern is formed onto the source PCBin lieu of a conventional FPC for supplying an electric signal to aninverter, thereby simplifying the internal structure of the displaymodule.

[0137] In addition, using the bent-type source PCB, the electric signalapplied via the conductive pattern is applied by connectingboard-to-board to the inverter and the source PCB. The source PCB andthe gate PCB are electrically connected board-to-board, to therebyreduce an overall thickness. Moreover, the display module can be easilyassembled, eliminating the need for connecting members like anadditional FPC.

[0138] Such a board-to-board connection method is possible due to thestructure of the source PCB bent and fixed to the rear surface of themold frame. The present invention has a structure of a low positionedsource PCB and a high positioned inverter and gate PCB when connected.

[0139] Meanwhile, the inverter supporting bar formed integrally with themold frame is used for fixing the inverter, to thereby enhance assemblyefficiency. The inverter can be more easily assembled by fixing theprotrusion formed at the inverter supporting bar into the groove formedat the inverter.

[0140] The LCD module can be more firmly fixed to the rear case by themain chassis, which presents higher reliability in the shock andvibration test.

[0141] This invention has been described above with reference to theaforementioned embodiments. It is evident, however, that manyalternative modifications and variations will be apparent to thosehaving skills in the art in light of the foregoing description.Accordingly, the present invention embraces all such alternativemodifications and variations as fall within the spirit and scope of theappended claims.

What is claimed is:
 1. A display module of a liquid crystal display(LCD) device, comprising: a rear case; a backlight assembly formed bydepositing and fixing a reflector plate, a light guide plate, and aseries of sheets onto a mold frame where a lamp assembly receivingportion, a gate PCB receiving portion, and a source PCB receivingportion are integrally formed; an LCD panel module having an upperpanel, a lower panel coupled to the upper panel with a liquid crystallayer inserted therebetween, a gate PCB electrically connected to an endportion of said lower panel, and a source PCB electrically connected toanother end portion of said lower panel and having a conductive patternfor an electric signal to be applied to an inverter; a main chassis thatdefines an active screen area of said LCD panel module and couples themold frame and said LCD panel module to said rear case; and a front casecoupled to said main chassis and covering a whole surface of said LCDpanel module excluding said active screen area.
 2. The display moduleaccording to claim 1, wherein the source PCB and the gate PCB of saidLCD panel module are directly and electrically connected by aboard-to-board method.
 3. The display module according to claim 2,wherein a first connector for connecting the gate PCB and the source PCBis formed in a predetermined area of the gate PCB and a second connectorfor connecting the gate PCB and the source PCB is formed in an area ofthe source PCB corresponding to the first connector, the first andsecond connectors are coupled so as to be electrically connected.
 4. Thedisplay module according to claim 3, wherein the first and secondconnectors are coupled in such a manner that the second connector isbeing positioned under the first connector.
 5. The display moduleaccording to claim 1, wherein the source PCB of the LCD panel module andthe inverter are directly and electrically connected by a board-to-boardmethod.
 6. The display module according to claim 5, wherein the inverterhas at one of its end portion a first connector for connecting to thesource PCB, and the source PCB has at its portion corresponding to thefirst connector a second connector for connecting to the source PCB, thefirst and second connectors being coupled so as to be electricallyconnected.
 7. The display module according to claim 6, wherein the firstand the second connectors are coupled in such a manner that the secondconnector is being positioned under the first connector.
 8. The displaymodule according to claim 1, wherein the source PCB is electricallyconnected to the lower panel using a flexible printed circuit (FPC)inserted therebetween, and a source driver IC is mounted onto a rearsurface of the FPC.
 9. The display module according to claim 8, whereinthe gate PCB is electrically connected to the lower panel using aflexible printed circuit (FPC) inserted therebetween, and a gate driverIC is mounted onto a front surface of the FPC.
 10. The display moduleaccording to claim 1, wherein the source PCB has a coupling hole forgrounding and fixing the source PCB onto a rear surface of the moldframe.
 11. A display module of a liquid crystal display device,comprising: a rear case shaped as a four-cornered container havingsidewalls on each of its four edges; a backlight assembly formed bydepositing and fixing a reflector plate, a light guide plate, and aseries of sheets onto a mold frame having a lamp assembly receivingportion, an inverter supporting bar for supporting an inverter, a gatePCB receiving portion and a source PCB receiving portion integrallyformed at its right, left, upper, and lower edges; an LCD panel modulehaving an upper panel, a lower panel coupled to the upper panel with aliquid crystal layer inserted therebetween, a gate PCB electricallyconnected to an end portion of the lower panel, and a source PCBelectrically connected to another end portion of the lower paneladjacent to the end portion of the lower panel; a main chassis thatdefines an active screen area of said LCD panel module and couples themold frame and said LCD panel module to said rear case; and a front casecoupled to the main chassis and covering a whole surface of the LCDpanel module excluding the active screen area.
 12. The display moduleaccording to claim 11, wherein the inverter supporting bar has at itsupper surface an insertion protrusion.
 13. The display module accordingto claim 12, wherein the inverter has at a portion corresponding to theinsertion protrusion through a hole.
 14. The display module according toclaim 11, wherein the inverter has at a portion corresponding to theinverter supporting bar a guide groove formed in its widthwisedirection.
 15. The display module according to claim 11, wherein theinverter is supported by the inverter supporting bar so that componentsof the inverter face the rear case.
 16. The display module according toclaim 11, wherein the gate PCB receiving portion of the mold frame has aplurality of windows surrounded by sidewalls and separated by separatingwalls and accommodating components of the gate PCB.
 17. The displaymodule according to claim 11, wherein an FPC for electrically connectingthe lower panel and the source PCB is bent by 180 degrees so that thesource PCB is fixed onto a rear surface of the mold frame.
 18. Thedisplay module according to claim 17, wherein the mold frame has at itslower edge of a rear surface a driver IC receiving groove foraccommodating a driver IC mounted on the FPC.
 19. The display moduleaccording to claim 11, wherein the mold frame has at its bottom surfacea supporting plate, which removed a portion corresponding to the sourcePCB.
 20. A display module of a liquid crystal display device,comprising: a rear case shaped as a four-cornered container havingsidewalls on each of its four edges; a backlight assembly formed bydepositing and fixing a reflector plate, a light guide plate, and aseries of sheets onto a mold frame having a lamp assembly receivingportion, an inverter supporting bar, a gate PCB receiving portion and asource PCB receiving portion at its right, left, upper, and lower edges;an LCD panel module having an upper panel, a lower panel coupled to theupper panel with a liquid crystal layer inserted therebetween, a gatePCB electrically connected to an end portion of the lower panel, and asource PCB electrically connected to another end portion of the lowerpanel adjacent to the end portion of the lower panel and having aconductive pattern for an electric signal to an inverter; a main chassisthat defines an active screen area of the LCD panel module and couplesthe mold frame and the LCD panel module to the rear case; and a frontcase coupled to said main chassis and covering a whole surface of saidLCD panel module excluding said active screen area.
 21. The displaymodule according to claim 20, wherein the rear case has at both of itsend portions of a lower edge hinge receiving portions.
 22. The displaymodule according to claim 20, wherein the rear case has a bottom surfacecorresponding to the lamp assembly, the gate PCB, the source PCB, andthe inverter deposited with an insulating material.
 23. The displaymodule according to claim 22, wherein the insulating material includesan insulating tape.
 24. The display module according to claim 20,wherein the rear case is made up of a magnesium alloy.
 25. The displaymodule according to claim 20, wherein the rear case has at a bottomsurface a plurality of bosses for fixing the main chassis.
 26. Thedisplay module according to claim 20, wherein the rear case has at itsupper and lower walls a plurality of guide walls formed spaced apartfrom each other and toward an inner side from the upper and lower wallsat irregular intervals, and the size defined by the guide walls is thesame as that of the mold frame.
 27. The display module according toclaim 20, wherein an electric signal is transmitted from a main body ofa computer to the source PCB of the LCD panel module via an FPC forconnecting the source PCB and the main body.
 28. The display moduleaccording to claim 27, wherein the FPC for connecting the source PCB andthe main body has a center portion in lengthwise direction woundrotatably to an FPC holder that is fixed to a hinge.
 29. The displaymodule according to claim 27, wherein the FPC is connected to the sourcePCB by inserting one of its end into a terminal block mounted on thesource PCB, and also is connected to the main body through the otherend.
 30. The display module according to claim 20, wherein the mainchassis is shaped as a four-cornered container having sidewalls on eachof its four edges, and has a plurality of coupling holes that correspondto a plurality of bosses formed integrally with the rear case along theedges.
 31. The display module according to claim 30, wherein the mainchassis has at its center portion a window for the active screen area.32. The display module according to claim 30, wherein the main chassishas a size to such an extent that a predetermined space is providedbetween the sidewalls of the main chassis and said sidewalls of the rearcase when the main chassis is fixed to the rear case.
 33. The displaymodule according to claim 30, wherein at least one of the coupling holesof the main chassis is connected to the boss of the rear case via a tabof the mold frame.
 34. The display module according to claim 30, whereinthe main chassis is made up of a stainless steel.
 35. The display moduleaccording to claim 20, wherein said front case is shaped as afour-cornered container having sidewalls on each of its four edges, andhas at a center portion a window for the active screen area.
 36. Thedisplay module according to claim 35, wherein said front case has at itsrear surface protrusions to be fixed into coupling grooves formed at asidewall of the main chassis.
 37. The display module according to claim35, wherein said front case has at a predetermined positioncorresponding to a hinge receiving portion of said rear case a hingecover portion.
 38. The display module according to claim 20, wherein thelamp assembly receiving portion has fixing ribs for fixing a lamp wireformed alternately at facing edges of said lamp assembly receivingportion, and a reinforcement rib for reinforcing said lamp assemblyreceiving portion formed at a position where another lamp wire escapesfrom said lamp assembly receiving portion.
 39. A method for assembling adisplay module, comprising the steps of: mounting an LCD panel to abacklight assembly formed through an additional step by depositing areflector plate, a light guide plate, and a series of sheets onto a moldframe, and fixing a source PCB of the LCD panel onto a rear surface ofthe mold frame by bending the source PCB; mounting the backlightassembly to a rear case; mounting an inverter to an inverter supportingbar formed integrally with the mold frame; coupling a main chassis tothe rear case so as to fix the backlight assembly and define an activescreen area; and coupling a front case to the main chassis so as tocover a whole surface excluding the active screen area of the LCD panel.40. The method according to claim 39, wherein the source PCB and a gatePCB of the LCD panel are directly and electrically connected by aboard-to-board method when the source PCB of the LCD panel is fixed tothe rear surface of the mold frame.
 41. The method according to claim40, wherein the source PCB of the LCD panel and the inverter aredirectly and electrically connected by a board-to-board method after theinverter is mounted to the inverter supporting bar of the mold frame.